HighLine Dispensing Technology

Solar cell metallization for printing technology faces several challenges that impact efficiency, cost, and scalability. The primary material used, silver, is expensive and has limited availability, prompting the need for alternatives like copper, which come with their own complexities. Ensuring minimal resistive losses and shading while maintaining high precision and throughput is crucial for efficiency. The process involves multiple printing steps via screen- or stencil printing, which increasingly impede further improvement in terms of throughput, material consumption and overall COO optimization.

Solder paste printing, dam and fill, and underfill processes in semiconductor manufacturing each present unique challenges that impact efficiency and reliability. Solder paste printing requires meticulous control of parameters like stencil design and paste viscosity to avoid defects such as insufficient solder and voids. The dam and fill process involves precise application of dam materials to create barriers and accurate dispensing of fill materials to prevent air entrapment and ensure complete coverage. These processes demand precise control to ensure high-quality semiconductor products.

Handling adhesives and electrically conductive adhesives (ECAs) in screen- or stencil printing for interconnection and mechanical joining involves several challenges. The viscosity and rheology of the adhesive must be precisely controlled to ensure accurate deposition without undesired curing or change in rheology. Cost and efficiency are important considerations, as ECAs can be more expensive than traditional soldering materials, necessitating efficient use and minimal waste. Achieving consistent results in the screen-printing process is challenging, as environmental factors such as temperature variation and air contact affect the rheology of adhesives and can hardly be controlled.

The thick-film printing of functional layers such as anodes and cathodes in electrolysis or batteries presents several challenges. Achieving uniform thickness and composition across large areas is difficult, leading to potential performance inconsistencies. Established production processes like slot-die coating, physical vapor deposition (PVD), and screen printing each have their weaknesses. Slot-die coating, while precise, can be costly and complex for intermitting printing. PVD offers high-quality films but is limited by its slow deposition rates and high vacuum requirements resulting in high COO and CAPEX. Screen printing, although cost-effective and scalable, often results in porous microstructures (from mesh marks) that can limit electrochemical performance and durability. These challenges necessitate the development of improved techniques for better control and consistency in producing these critical components.